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                                            Yiyang Smuyang Electronic Technology Co.,Ltd.
                                            Contact: Lei Jianhua
                                            Tel: 0737-4399831
                                            Mobile: 18033401800
                                            E-mail: sales02@yysgmy.com
                                            Web: m.blackgoldore.com
                                            Add: Changchun Economic and Technological Development Park, Yiyang City, Hunan Province
                                            Technical Advantage
                                            The thin film circuit ceramic package substrate is a technique of metallization and electroplating process by magneised sputtering art: that is, according to the application needs, in high thermally conductive ceramic matrix, a film metallization and image transfer mode is made of 2D metal line, and then adopted TCV (Through Ceramic VIA) technology forms a vertical interconnection between double-sided wiring, and finally, a stacked technique is used to obtain a integrated 3D metal frame with a ceramic matrix binding. Based on the thin film circuit process, the ceramic surface metallization is achieved by magnetron sputtering. The thickness of the copper layer and the gold is greater than 10 microns, which is more than 10 microns, and the DPC (DirectPlateCopper-direct copper plating substrate).
                                            ● The solder resistability of the substrate is high.  
                                            ● The thickness of the conductive layer is destined within 1 um ~ 1mm.  
                                            ● Thin lines, the minimum thread distance reaches 0.05mm, thereby realizing short, small, light and thin  
                                            ● Complete, lower-resistant metal film  
                                            ● The copper layer does not contain the oxide layer, which can be used in a reduction of the inner.  
                                             
                                            Company Profile
                                            Yiyang Shuguang Muyang Electronic Technology co., LTD,which is located in Changchun Economic and Technological Development Park, Yiyang City, Hunan Province, has a registered capital of 12 million yuan and 85 employees.It is a collection of r & d, design and sales of foreign trade in the integration of new semiconductor components and electronic packaging substrate manufacturing high-tech enterprise.

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                                            The origin and application of electronic ceramic substrate
                                            The origin and application of electronic ceramic substrate Shanghai Silicate Research Institute, Chinese Academy of Sciences ( Sicas On November 9, the histo……
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                                            Contact Us Yiyang Smuyang Electronic Technology Co.,Ltd.
                                            Contact: Lei Jianhua
                                            Tel: 0737-4399831
                                            Mobile: 18033401800
                                            E-mail: sales02@yysgmy.com
                                            Web: m.blackgoldore.com
                                            Add: Changchun Economic and Technological Development Park, Yiyang City, Hunan Province

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